Surgical treatment method and instrument
US5020995A · kind A · utility
88Cited by
8References
27Claims
0Family size
Inventor
Key dates
| Filing date | Jan 18, 1989 |
| Grant date | Jun 4, 1991 |
| Priority date | — |
| Expiry date | Jan 18, 2009 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/30
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A method and apparatus for cutting tooth tissue by generating laser radiation at a wavelength which is absorbed more strongly by hydroxyapatite than by water; producing a succession of pulses of the generated radiation with an energy level, pulse duration, and repetition rate selected to cut the tooth tissue without causing harmful side effects; and concentrating the radiation pulses on the tissue to a spot sufficiently small to cause cutting of the tissue.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.