Electroconductive integrated substrate and process for producing the same
US5021284A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 24, 1989 |
| Grant date | Jun 4, 1991 |
| Priority date | — |
| Expiry date | Feb 24, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/30
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electroconductive integrated substrate and a process for producing the same, which comprises a porous carbonaceous plate having a large number of pores and gas permeability, and a gas unpermeable electroconductive plate laminated on the porous carbonaceous plate and integrally bonded thereto by thermoplastic resin which is present substantially only in the pores of the porous carbonaceous plate. It is preferred to use thermoplastic resin having a melting viscosity of from 10.sup.2 to 10.sup.6 poises, and a gas permeable porous carbonaceous plate having a mean pore diameter of from 20 to 150 .mu.m and a porosity of from 40 to 85%. The porous carbonaceous plate and the gas impermeable electroconductive plate are laminated one upon the other with a thermoplastic resin film interposed therebetween, and the film is melted to bond the plates together. The integrated substrate obtained has an electrical resistance of not greater than 7 m.OMEGA., preferably not greater than 1.5 m.OMEGA., at the bonded surface in the thickness direction thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.