Semiconductor integrated circuit apparatus
US5021866A · kind A · utility
20Cited by
13References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 28, 1988 |
| Grant date | Jun 4, 1991 |
| Priority date | — |
| Expiry date | Sep 28, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor integrated circuit device including first and second transmission leads formed on both sides of a resin film on which a semiconductor integrated circuit chip is mounted. These leads are connected at portions immediately close to the high-speed input terminals of the chip by through-hole leads. This chip-to-lead configuration according to the present invention is significantly effective for a GaAs logic integrated circuit or the like that processes high-speed input signals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.