Apparatus for coating three dimensional substrates by means of cathode sputtering

US5022978A · kind A · utility

Assignee

• Leybold GmBH · DE

Inventors

• Bernd Hensel · Eschborn, DE
• Uwe Kopacz · Großkrotzenburg, DE
• Dieter Hofmann · Augsburg, DE
• Hans Schussler · Bad Marienberg, DE
• Gunter Eckhardt · Hanau, DE

Key dates

• Filing date: Jul 5, 1990
• Grant date: Jun 11, 1991
• Expiry date: Jul 5, 2010

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C23C14/505
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A device for coating substrates has a rectangular magnetron cathode 2 with a target, a substrate holder 16 that can be rotated around a rotating axis 17 which is parallel to the longitudinal edges of the target, a planar wall 20 made of a non-magnetic material and having longitudinal edges 21, 22 also parallel to the rotating axis 17. Behind the wall there is a magnet arrangement and the magnetron cathode 2 and the wall 20 are disposed on opposite sides of the rotating axis. The device further includes a planar anode. In order to intensify and the effect of the plasma and render it more uniform, the distance on the substrate path between the longitudinal edges 12, 13 of the target and the longitudinal edges 21, 22 of the wall parallel thereto is reduced by at least one additional wall 25, 26 with a magnet arrangement 27, 28 disposed therebehind. Further, the poles of all the magnet arrangements 23, 27, 28 alternate on the circumference of the substrate holder 16 such that the entire circumference of the substrate holder is surrounded by an uninterrupted series of magnetic tunnels.