Resin molded type semiconductor device having a conductor film
US5023699A · kind A · utility
14Cited by
16References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 10, 1989 |
| Grant date | Jun 11, 1991 |
| Priority date | — |
| Expiry date | Oct 10, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A resin molded type semiconductor device has a metallic ring that is formed to cover the peripheral edge of the surface of a tetragonal semiconductor substrate. In order to prevent a passivation film on the ring from being cracked by stresses due to a resin mold package concentrating in the four corners of the semiconductor substrate, slits or rows of small holes are formed in the corner portions of the ring.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.