Double-sided backplane assembly
US5023754A · kind A · utility
49Cited by
2References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 19, 1990 |
| Grant date | Jun 11, 1991 |
| Priority date | — |
| Expiry date | Jan 19, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1445
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A double-sided backplane assembly is provided for increasing the logic element density in a logic cage or CEC. The backplane assembly is multi-layered with a backplane card centrally located between a stiffener and an EMC shield affixed to each side thereof. Connectors for connecting logic elements to the backplane card are provided on both sides of the backplane card, so that a logic cage having two sub-cages may be provided, the two sub-cages sharing the one backplane assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.