Photonics module and alignment method
US5023881A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 19, 1990 |
| Grant date | Jun 11, 1991 |
| Priority date | — |
| Expiry date | Jun 19, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/0237
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A laser (24) is mounted in predetermined alignment with a monocrystalline mounting member (11) by defining in the mounting member a reference surface (18) that is displaced from a second surface (19). Solder (29) is placed on a second surface such that in its solid form its length and width each significantly exceeds its height. The laser is bonded to the reference surface such that part of the laser overlies the solder and is separated from the solder by a small gap (30). Next, the solder is melted to cause it to gather on the second surface sufficiently to contact an under surface (31) of the laser. The solder is then cooled such that the solder bonds the laser to the silicon mounting member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.