Method of manufacturing a microwave intergrated circuit substrate including metal lined via holes
US5023994A · kind A · utility
3Cited by
11References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 29, 1988 |
| Grant date | Jun 18, 1991 |
| Priority date | — |
| Expiry date | Sep 29, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of forming a microwave integrated circuit substrate which includes via holes connecting the upper and lower surfaces of the substrate in which the upper end of the via hole is closed by a conductive membrane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.