Method of cooling a semiconductor device with a cooling unit, using metal sherbet between the device and the cooling unit
US5024264A · kind A · utility
34Cited by
5References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 8, 1989 |
| Grant date | Jun 18, 1991 |
| Priority date | — |
| Expiry date | May 8, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73253
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of cooling a device with a cooling unit, using a metal sherbet, which is metal being in a state of a two-phase composition consisting of a liquid phase and a solid phase, as a heat conducting body put between the cooling unit and the heat generating device for transferring heat generated in the device to the cooling unit. The metal sherbet is metal, such as an In-Ga binary system, in which solids of an In-Ga solid solution are dispersed in an In and Ga liquid at a temperature obtained under normal operations of the device and the cooling unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.