Process for electroplating utilizing disubstituted ethane sulfonic compounds as electroplating auxiliaries and electroplating auxiliaries containing same
US5024736A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 24, 1989 |
| Grant date | Jun 18, 1991 |
| Priority date | — |
| Expiry date | May 24, 2009 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/38
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A process in which disubstituted ethane sulfonic compounds are employed as electroplating auxiliaries in electroplating. The compounds for use in combination with the claimed process have the general formula: ##STR1## wherein, A represents a pyridinium radical ##STR2## in which R.sub.1 and R.sub.2 denote hydrogen or an alkyl radical having 1 to 3 carbon atoms, or R.sub.1 and R.sub.2, together with the pyridinium radical, form a condensed six-membered aromatic ring; or, PA1 A represents a mercapto radical of the formula --S--R.sub.4, in which R.sub.4 denotes hydrogen or the group: ##STR3## and R.sub.3 is an alkyl group having 1 to 4 carbon atoms. Also included within the scope of the present invention are alkali or ammonium salts of the compounds of the foregoing structural formula.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.