Positive working polyamic acid/imide and diazoquinone photoresist with high temperature pre-bake
US5024922A · kind A · utility
14Cited by
8References
9Claims
0Family size
Inventors
Key dates
| Filing date | Nov 7, 1988 |
| Grant date | Jun 18, 1991 |
| Priority date | — |
| Expiry date | Nov 7, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Positive working polyamic acid photoresist compositions are disclosed having improved high resolution upon image development and exhibiting stable photosensitivity and superior dielectric performance. The compositions comprise polyamic acid condensation products of an aromatic dianhydride and an aromatic di-primary amine wherein a percentage of the diamine comprises special dissolution inhibiting monomers. The compositions may be further improved by the presence of particular supplemental additives.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.