Photosensitive poly(amide)imide heat-resistant polymer
US5025088A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 19, 1990 |
| Grant date | Jun 18, 1991 |
| Priority date | — |
| Expiry date | Jul 19, 2010 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0757
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present invention here disclosed is directed to a photosensitive polymer having an inherent viscosity of 0.1 to 5 dl/g and represented by the general formula ##STR1## wherein R.sup.1 is independently a trivalent or tetravalent carbon cyclic aromatic group or heterocyclic group; R.sub.2 is independently an aliphatic group having at least 2 carbon atoms, an alicyclic group, an aromatic aliphatic group, a carbon cyclic aromatic group, a heterocyclic group or a polysiloxane group; R.sub.3 and R.sub.4 are CH.sub.2 --CH.dbd.CH.sub.2 ; m is 1 or 2; n is 0 or 1; and m and n satisfy 1.ltoreq.m+n.ltoreq.2. The photosensitive polymer of the present invention is applicable as electronic materials such as passivation films of semiconductors and print circuits.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.