Multi-layer lead frames for integrated circuit packages
US5025114A · kind A · utility
54Cited by
20References
32Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 30, 1989 |
| Grant date | Jun 18, 1991 |
| Priority date | — |
| Expiry date | Oct 30, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A composite leadframe is provided. The leadframe comprises a rigid metal portion electrically interconnected to a flexible multi-layer portion. When sealed within an electronic package, the composite leadframe provides a higher lead density than achieved by rigid metal leadframes and better electrical and mechanical properties than achieved with flexible leads. The package may comprise a discrete base and cover component with the leadframe disposed between or a monolithic block of plastic encapsulating the electronic device and a portion of the leadframe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.