Integrated circuits having improved fusible links
US5025300A · kind A · utility
71Cited by
9References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 25, 1990 |
| Grant date | Jun 18, 1991 |
| Priority date | — |
| Expiry date | Jul 25, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit includes a conductive fusible link (14) that may be blown by laser energy. The dielectric material (15) covering the fuse is etched away to expose the fuse. A protective dielectric layer (30) is formed on the fuse to a controlled thickness less than that of the interlevel dielectric. The resulting structure prevents shorts between conductors that might otherwise occur due to debris from the fuse-blowing operation, and provides protection to the integrated circuit. In addition, the fuse blowing operation is more consistent from fuse to fuse.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.