Method of making semiconductor integrated circuit device with polysilicon contacts
US5025741A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 28, 1989 |
| Grant date | Jun 25, 1991 |
| Priority date | — |
| Expiry date | Apr 28, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor integrated circuit device having a wiring line of aluminum film or aluminum alloy film covered with a silicon insulation film and connected to the semiconductor region formed on the principal surface of a single crystal silicon substrate, with a polycrystalline silicon film interposed, wherein said silicon film is a polycrystalline silicon film composed of large crystal grains which is formed by depositing in amorphous state and then heat-treating the deposited film, said polycrystalline silicon film reduces the amount of silicon atoms which separates out in said wiring line. Also said wiring line is provided with a shielding film which is disposed between said insulation film and at least the upper surface and lower surface of said wiring line and which prevents silicon atoms from separating out from said insulation film. A process for manufacturing a semiconductor integrated circuit device which comprises the steps of depositing an amorphous silicon film on the principal surface of said semiconductor region, and performing heat treatment on said silicon film, thereby converting the amorphous silicon film into a polycrystalline silicon film composed of large crysta…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.