Sputtering apparatus
US5026470A · kind A · utility
30Cited by
4References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 19, 1989 |
| Grant date | Jun 25, 1991 |
| Priority date | — |
| Expiry date | Dec 19, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/332
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A sputtering apparatus in which the electrode for supporting the substrates upon which thin magnetic films are to be deposited has a polygon-shaped planar coil adjacent to a surface so that the coil can be energized to produce a uniform magnetic field at the surface of the substrates which is oriented normal to the polygon faces of the coil. This apparatus produces uniform easy axis of the thin magnetic films deposited on the substrates during relative motion between the substrates and the target electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.