Polyamide molding materials

US5026763A · kind A · utility

Assignee

• BASF SE

Inventors

• Volker Lohrbaecher · Weinheim, DE
• Erich Pellkofer · Mutterstadt, DE

Key dates

• Filing date: Jul 19, 1989
• Grant date: Jun 25, 1991
• Expiry date: Jul 19, 2009

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08L77/02
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

Polyamide molding materials having high heat distortion resistance for the production of blow-molded articles contain essentially two highly viscous polyamides which are homogeneously miscible with one another and have melting points which differ by 10.degree.-50.degree. C., the amount of the polyamide having the low melting point being from 5 to 40% by weight and the amount of that having the high melting point being from 60 to 95% by weight.