Adducts of an hydroxy-free acrylate resin and an epoxy resin
US5026794A · kind A · utility
10Cited by
5References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 23, 1989 |
| Grant date | Jun 25, 1991 |
| Priority date | — |
| Expiry date | May 23, 2009 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L63/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
This invention provides an adduct of an epoxy resin and a hydroxy free acrylate resin. The novel adduct contains vinyl unsaturation and hence may be copolymerized with an ethylenically unsaturated monomer to provide a tough thermoset resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.