Printed circuit boards and cards having buried thin film capacitors and processing techniques for fabricating said boards and cards
US5027253A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 9, 1990 |
| Grant date | Jun 25, 1991 |
| Priority date | — |
| Expiry date | Apr 9, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/435
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed is a multilayer circuit package having a buried thin film capacitor. The circuit package includes at least a power core, a ground core, a first signal core, a second signal core, and the integral, buried, thin film capacitor. The integral, buried, thin film capacitor serves to capacitively couple the first and second signal cores. Structurally, the first signal core includes at least one first wire that terminates in at least one first electrode, while the second signal core includes at least one second wire that terminates in at least one second electrode. At least a portion of the first electrode overlays at least a portion of the first electrode overlays at least a portion of the second electrode and is separated therefrom by a thin film of a dielectric material. The first electrode, the second electrode, and the thin film of dielectric material define the integral buried capacitor. The thin film capacitor is prepared by thin film methodology, with epitaxial deposition of the dielectric.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.