Method of producing electronic components
US5027505A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 5, 1990 |
| Grant date | Jul 2, 1991 |
| Priority date | — |
| Expiry date | Mar 5, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53261
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention provides a method of producing electronic components such as LED displays and hybrid IC's from a broad supply frame. The frame comprises a parallel pair of elongate side bands, and a plurality of unit circuit boards integrally incorporated in the frame by means of connecting webs and arranged between the pair of side bands at a predetermined interval therealong. Various process steps such as chip bonding and wire bonding are performed with respect to the individual circuit boards while they are still in the frame. In a final step, each unit circuit board or electronic component is separated from the frame. The frame may be provided with an identification pattern to identify the type of unit circuit boards incorporated in the frame.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.