Method for characterization of adhesion between hard materials
US5027650A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 8, 1990 |
| Grant date | Jul 2, 1991 |
| Priority date | — |
| Expiry date | May 8, 2010 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N19/04
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A microscratch-test method for measuring adhesion between a first material and a second material adhered to one another at an interface and forming an article. The method involves polishing a planar surface of the article generally normal to the interface and exposing the interface and the first and second materials. A static load of predetermined mass is applied to a starting point on the first or second material in a direction generally normal to the planar surface, using a load means of a third material harder than the first and second materials. The load means is moved across the planar surface from the starting point in a straight line generally toward and across the interface at an angle relative to the interface of between 90.degree. and about 20.degree.. These steps are repeated, varying the mass. The starting point for each repetition is spaced apart from other starting points but is approximately equidistant with other starting points from the interface. The lowest value of the predetermined mass is observed at which a predetermined level of damage to one or more of the interface, first material, and second material occurs. The scratch angle may be constant or may vary wi…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.