Patent · US Expired

Process for bonding semiconductor chips to substrates

US5027995A · kind A · utility

10Cited by

7References

12Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Alois Karl · Wolfratshausen, DE
Karl Osojnik · Munich, DE
Werner Spaeth · Holzkirchen, DE
Guenther Waitl · Regensburg, DE

Key dates

Filing date	Feb 19, 1991
Grant date	Jul 2, 1991
Priority date	—
Expiry date	Feb 19, 2011

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/30107
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor chip (1) is bonded to a substrate (2) serving as a component housing, a contact part, an insulative part or a connecting part without the use of a high-temperature process or any additional bonding medium such as solder or flux. The backside of the semiconductor chip (1) or substrate (2) is structured to include specially formed bumps (3) for the necessary connections. A ductile metal is used for these bumps (3). The bond to the substrate (2) is formed by using pressure and/or ultrasonic energy. The process according to this invention is particularly suitable for bonding components in data link receivers, optoelectronic couplers, transmitters (LEDs, IREDs) and ISDN modules.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.