Corrugated metal-clad sandwich panel with a wafer composite core
US5028371A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Sep 25, 1990 |
| Grant date | Jul 2, 1991 |
| Priority date | — |
| Expiry date | Sep 25, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1039
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A corrugated metal-clad sandwich panel with a wafer composite core is provided. The single stage process for the panel manufacture involves utilizing a press platen system which is mechanically convertible between a planar and a corrugated configuration. The metal sheet is first placed on the lower platen which is in the planar configuration. The wafers and an isocyanate resin in admixture are uniformly distributed over the metal sheet. Optionally, a second metal sheet is placed over the wafer/resin mat. The platens are converted from the planar to the corrugated configuration, thus forming the corrugated metal-clad sandwich panel having a waferboard core in a single stage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.