Three dimensional microcircuit structure and process for fabricating the same from ceramic tape
US5028473A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 2, 1989 |
| Grant date | Jul 2, 1991 |
| Priority date | — |
| Expiry date | Oct 2, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electrical circuit pattern is formed on a glass-ceramic, thermally fusible tape. The tape is heated to a temperature at which it becomes temporarily plastic, and is then bent into a desired non-planar shape. Further application of heat causes the tape to be sintered in the non-planar shape. A multi-layer structure can be provided by laminating plural layers of Low-Temperature-Cofired-Ceramic (LTCC) tape with respective circuit patterns formed thereon together, and plastically bending the laminated structure into the non-planar shape during the heating step. A circuit structure including an edge connector can be formed by laminating a layer of glass-ceramic transfer tape having an electrical circuit pattern which includes conductor strips formed on an edge connector portion thereof onto a relatively rigid substrate, such that the edge connector portion is bent around an edge of the substrate to form a rigid edge connector. The edge connector portion of the transfer tape which is formed into a non-planar shape during the lamination step, is fused together with the remaining portion of the transfer tape onto the substrate during the heating step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.