Semiconductor cooling module
US5028989A · kind A · utility
25Cited by
12References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 22, 1990 |
| Grant date | Jul 2, 1991 |
| Priority date | — |
| Expiry date | May 22, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A plurality of semiconductor elements are mounted on a substrate. A plurality of cooling elements are inserted between a thermal conductor for conducting a heat generated from the semiconductor elements to a cooling medium and the semiconductor elements. A channel for conducting the generated heat of the semiconductor elements to the cooling medium is provided near the cooling elements and between the thermal conductor and a channel plate mounted on the thermal conductor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.