Semiconductor bridge (SCB) packaging system
US5029529A · kind A · utility
24Cited by
12References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 25, 1989 |
| Grant date | Jul 9, 1991 |
| Priority date | — |
| Expiry date | Sep 25, 2009 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF42B3/13
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The present invention is direct to primer housings to secure a semiconductor bridge device in close proximity to an energetic charge. The primer housings are formed from an electrically conductive alloy and contain a dielectric medium disposed between components to maintain electrical isolation. The housings are characterized by high ductility to resist fracture during assembly or handling. In certain embodiments, one or both lead wires are removed to reduce the potential for lead wire breakage or separation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.