Semiconductor wafer transferring method and apparatus and boat for thermal treatment of a semiconductor wafer
US5030057A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 3, 1988 |
| Grant date | Jul 9, 1991 |
| Priority date | — |
| Expiry date | Nov 3, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer transferring method for transferring wafers between a cassette and a boat having grooves to hold the wafers, comprises the steps of providing an identification mechanism for positional alignment on the boat in advance, detecting the identification mechanism, and aligning the boat to a predetermined position based on a detection result and transferring the wafers from the cassette to the boat. A wafer transferring apparatus comprises a loading device for extracting wafers from a cassette and transferring the wafers onto a boat, a detection device for detecting an identification section provided on the boat in order to identify a wafer transferring position on the boat, and a control device for acquiring the wafer transferring position on the boat based on a detection result attained from the detection device and controlling a mutual position between the boat and the cassette to come to a predetermined position.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.