Solder-bearing lead
US5030144A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Apr 13, 1990 |
| Grant date | Jul 9, 1991 |
| Priority date | — |
| Expiry date | Apr 13, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49204
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A solder-bearing lead adapted to be soldered to a conductive surface comprising an elongated body portion having a solder-bearing portion, a terminal portion, and a middle portion disposed between said solder-bearing portion and said terminal portion. The solder-bearing portion includes a pair of projections extending from one edge of said body portion and forming a gap therebetween dimensioned to receive a solder mass. A region of the middle portion is twisted so that the projections lie in a plane substantially perpendicular to the plane of the terminal portion. The solder-bearing lead can be used as an edge clip for mounting a substrate such as a printed circuit board/or as a surface-mounted lead for a substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.