Electroplating barrel
US5030330A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jun 22, 1990 |
| Grant date | Jul 9, 1991 |
| Priority date | — |
| Expiry date | Jun 22, 2010 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D17/22
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An improved, doorless, horizontal, perforated electroplating barrel which holds objects to be electroplated with cathode danglers when the barrel is rotated in one direction and upon reversal of the rotation of the electroplating barrel, the barrel empties itself. The improvement resides in the method of plating and design of the barrel that brings about an improved deposition of the electrolyte on parts so that when the parts are initially at a distance further removed from the cathode points, the electrical deposition is improved since the parts are caused to move to different zones in the barrel to be more proximately located for electrical contact with one of the cathode points during the plating operation. A deflector means is used in the barrel to cause a certain pattern to the tumbling parts in the barrel whereby parts initially loaded or dumped into the barrel contact the deflector means and are guided or forced inwardly toward the middle of the barrel so that when parts are internally dumped to a lower wall portion of the barrel they are deposited near the middle of the barrel, then, gradually, while the barrel is being rotated, the parts end up being moved and distributed…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.