Method for rubber-to-metal bonding
US5030515A · kind A · utility
8Cited by
8References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 16, 1990 |
| Grant date | Jul 9, 1991 |
| Priority date | — |
| Expiry date | Jan 16, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31522
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method for bonding a rubber substrate to a metal substrate wherein a primer composition is first applied to the surface of said metal substrate and the rubber substrate is then bonded to the primer composition-containing metal substrate surface using a rubber-to-metal bonding adhesive, the improvement comprising employing as the primer composition a mixture comprising an epoxidized diene polymer having a molecular weight of about 500 to 30,000 and a resole type phenolic resin, in a weight ratio of about 2 to 100 parts of said diene polymer per 100 parts of said resole type phenolic resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.