Thermoplastic molding compositions based on polyamide mixtures

US5030689A · kind A · utility

Assignee

• BASF SE

Inventors

• Christoph Plachetta · Schifferstadt, DE
• Walter Goetz · Ludwigshafen, DE
• Gerd Blinne · Worms, DE

Key dates

• Filing date: Oct 20, 1988
• Grant date: Jul 9, 1991
• Expiry date: Oct 20, 2008

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08L77/00
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

Thermoplastic molding compositions contain as essential components PA1 (A) 10-89% by weight of a copolyamide of PA2 (A.sub.1) 80-99% by weight of recurring units derived from adipic acid and hexamethylenediamine and PA2 (A.sub.2) 1-20% by weight of units derived from .epsilon.-caprolactam, PA1 (B) 10-80% by weight of polyhexamethyleneadipamide, PA1 (C) 1-40% by weight of an impact-modifying rubber and in addition PA1 (D) 0-60% by weight of a fibrous or particulate filler or a mixture thereof.