Patent · US Expired

Cooling arrangement for a semiconductor pump source

US5031184A · kind A · utility

12Cited by
0References
6Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 29, 1990
Grant dateJul 9, 1991
Priority date
Expiry dateJun 29, 2010

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01S5/4025
  • WIPO fieldOptics
  • WIPO sectorInstruments

Abstract

The invention is directed to a cooling arrangement for a semiconductor pump source which develops heat during operation. The cooling arrrangement includes a heat sink defining a seat for accommodating the pump source thereon and a cooling channel is formed in the heat sink for conducting a coolant therethrough to remove a major portion of the heat. A Peltier device is connected to the heat sink for finely controlling the temperature of the heat sink so as to permit the semiconductor pump source to emit radiation having a predetermined optional wavelength.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.