Cooling arrangement for a semiconductor pump source
US5031184A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 29, 1990 |
| Grant date | Jul 9, 1991 |
| Priority date | — |
| Expiry date | Jun 29, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/4025
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The invention is directed to a cooling arrangement for a semiconductor pump source which develops heat during operation. The cooling arrrangement includes a heat sink defining a seat for accommodating the pump source thereon and a cooling channel is formed in the heat sink for conducting a coolant therethrough to remove a major portion of the heat. A Peltier device is connected to the heat sink for finely controlling the temperature of the heat sink so as to permit the semiconductor pump source to emit radiation having a predetermined optional wavelength.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.