Method of manufacturing multilayered printed-wiring-board
US5031308A · kind A · utility
35Cited by
12References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 26, 1989 |
| Grant date | Jul 16, 1991 |
| Priority date | — |
| Expiry date | Dec 26, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a mutilayered printed-wiring-board comprises attaching conductive members on conductive layers, superimposing a plurality of printed-wiring boards, and electrically connecting the conductive layers with one another by the conductive members.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.