Installation for etching objects
US5032204A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jul 20, 1990 |
| Grant date | Jul 16, 1991 |
| Priority date | — |
| Expiry date | Jul 20, 2010 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23F1/46
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An installation for etching objects comprises at least one etching machine, in which metal is etched from the objects treated, the etching medium being enriched with metal. The etching medium is regenerated in at least one electrolytic cell by removing metal. Two buffer tanks are located in the lines which connect the etching machine to the electrolytic cell. A first control circuit ensures a substantially constant density of the etching medium in the etching machine. This takes place by the supply of depleted etching medium from the first buffer tank to the etching machine and by the removal of enriched etching medium from the etching machine into the second buffer tank. A second control circuit ensures a substantially constant density in the electrolytic cell by the supply of enriched etching medium from the second buffer tank into the electrolytic cell and by the removal of a corresponding quantity of depleted etching medium from the electrolytic cell into the first buffer tank. Both control circuits operate independently of each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.