Method and apparatus for applying liquid coatings on the surface of printed circuit boards
US5032426A · kind A · utility
17Cited by
8References
2Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 15, 1989 |
| Grant date | Jul 16, 1991 |
| Priority date | — |
| Expiry date | May 15, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1563
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and apparatus is provided for applying liquid coatings such as solder masks sequentially to both sides of a printed circuit board substrate whereby only one drying operation would be needed to dry the liquid coatings. An isolation platen having openings corresponding to the coated parts of the board is used to provide a space between the coated part and the opposite side of the platen.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.