Product defect detection using thermal ratio analysis
US5032727A · kind A · utility
46Cited by
8References
40Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 14, 1990 |
| Grant date | Jul 16, 1991 |
| Priority date | — |
| Expiry date | Sep 14, 2010 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N25/72
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method and apparatus for indicating defects in manufactured products employs, instead of the conventional thermal image subtraction, "thermal ratio analysis", which involves ratios of thermal data and their analysis including statistical analysis. Various techniques for "image" enhancement and for suppression of known artifacts are employed to facilitate the decision as to when a defect is detected. The thermal ratio analysis technique is particularly useful for detecting hidden defects in electronic circuitry, such as integrated circuits.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.