Soldering system and method of using same
US5033665A · kind A · utility
8Cited by
2References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 23, 1990 |
| Grant date | Jul 23, 1991 |
| Priority date | — |
| Expiry date | Feb 23, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/0465
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A soldering system includes a visualization station disposed in relatively close proximity to the final resting position of a circuit element to be soldered, and a back lighted head arrangement for helping transport the circuit element to the visualization station, and for helping facilitate the clear visualization of the element so that its position may be adjusted for possible misalignment at the time of its placement at the final position.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.