Process for brazing metallized components to ceramic substrates
US5033666A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 12, 1990 |
| Grant date | Jul 23, 1991 |
| Priority date | — |
| Expiry date | Apr 12, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/38
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for brazing a metallized component to a metallized ceramic-based substrate comprising the steps of: PA1 (a) applying a second conductor composition over the metallizations on the substrate such that the metallizations are covered by said second conductor composition which consists essentially of a metal powder and an organic medium; PA1 (b) drying said second conductor composition; PA1 (c) firing said second conductor composition at a temperature sufficient to sinter the metal powder of the second conductor composition and drive off said organic medium thereby forming a second metallization layer; PA1 (d) forming an assembly by positioning at least one metallized component on said second metallization layer and a brazing composition at the component-second metallization layer interface; and PA1 (e) heating said assembly at a temperature sufficient for said brazing composition to form a joint between said component and said second metallization layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.