Metal etching composition
US5034093A · kind A · utility
2Cited by
2References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 25, 1990 |
| Grant date | Jul 23, 1991 |
| Priority date | — |
| Expiry date | Sep 25, 2010 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23F1/28
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention is directed to a chemical etching composition for etching metals or metallic alloys. The composition includes a solution of hydrochloric acid, phosphoric acid, ethylene glycol and an oxidizing agent. The etching composition is particularly useful for etching metal surfaces in preparation for subsequent fluorescent penetrant inspection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.