Process for manufacturing embossed articles of synthetic resin with an undercut
US5034178A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 14, 1989 |
| Grant date | Jul 23, 1991 |
| Priority date | — |
| Expiry date | Jun 14, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1039
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A process and apparatus for manufacturing an embossed article of synthetic resin including heating a synthetic resin sheet to a softening temperature; pressing the heated synthetic resin sheet on an embossing die by a press die. The embossing die being made by an electro-chemical molding process and having an embossing surface with an embossing pattern thereon and a multitude of fine vacuum pores distributed uniformly over the entire embossing surface. Forcing the synthetic resin sheet against the embossing surface by applying suction through the fine vacuum pores to imprint the embossing pattern onto the synthetic resin sheet. The press die having an undercut shaping portion. Applying blowing pressure through the embossing dies and applying a vacuum through the undercut shaping portion. Thus, releasing the synthetic resin sheet from the embossing surface and forming an undercut in the synthetic resin sheet.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.