Multilayer systems and their method of production
US5034257A · kind A · utility
1Cited by
2References
4Claims
0Family size
Inventor
Key dates
| Filing date | Jul 28, 1989 |
| Grant date | Jul 23, 1991 |
| Priority date | — |
| Expiry date | Jul 28, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of producing a multilayer system comprising the steps of: PA0 1. adhering a continuous cohesive pattern of electrically conductive oxidizable material (e.g. copper) to an electrically insulating surface of a substrate, PA0 2. coating the pattern and the parts of the substrate surface not adhering to the pattern with a firable dielectric which is fusable at 500.degree.-600.degree. C., PA0 3. firing the dielectric to 500.degree.-600.degree. C. to cause fusion of the dielectric, whereby an oxide-fused dielectric bond is formed. Also multilayers having the features of the products of this method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.