Low density, high temperature resistant polymeric bodies
US5034422A · kind A · utility
43Cited by
6References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 19, 1990 |
| Grant date | Jul 23, 1991 |
| Priority date | — |
| Expiry date | Dec 19, 2010 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2483/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A low density, open cell polymeric body is formed by coating or filling a reticulated polymeric foam with a liquid-form polymer which is resistant to high temperatures, curing the liquid form polymer in and on the foam and then removing the foam skeleton by dissolving and leaching the foam out of the solid polymeric body which remains.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.