Semiconductor sealing epoxy resin composition
US5034436A · kind A · utility
2Cited by
3References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 9, 1990 |
| Grant date | Jul 23, 1991 |
| Priority date | — |
| Expiry date | Nov 9, 2010 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L83/10
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A semiconductor sealing epoxy resin composition includes a flexibilizer which is a previous reactant between a denatured silicone oil having epoxy groups and a phenol novolak resin, a novolak type of epoxy resin, a hardening agent, an accelerator, a filler, a die lubricant, and a surface treatment agent. This composition has a heat and moisture resistance needs for a semiconductor sealing material, and as well as a low elastic modulus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.