Thermoplastic molding materials based on polyamides and polyester elastomers
US5034450A · kind A · utility
28Cited by
16References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 24, 1989 |
| Grant date | Jul 23, 1991 |
| Priority date | — |
| Expiry date | Feb 24, 2009 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L77/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Thermoplastic molding materials contain, as essential components, PA0 A) from 40 to 99.5% by weight of a thermoplastic polyamide, PA0 B) from 0.5 to 15% by weight of a thermoplastic polyester elastomer and furthermore PA0 C) from 0 to 50% by weight of fibrous or particulate fillers or a mixture of these.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.