Curing agent compositions for epoxy resins and epoxy resin compositions
US5034493A · kind A · utility
4Cited by
5References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 13, 1989 |
| Grant date | Jul 23, 1991 |
| Priority date | — |
| Expiry date | Dec 13, 2009 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G59/4284
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Disclosed is a curing agent composition for epoxy resin, prepared by mixing together the following components (i), (ii) and (iii) and heating the mixture for modification: PA0 (i) at least one organic carboxylic acid zinc salt, PA0 (ii) at least one acid anhydride, and PA0 (iii) either (a) at least one phenol compound or (b) at least one glycidyl ester or glycidyl ether compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.