Electroless gold plating solution
US5035744A · kind A · utility
7Cited by
0References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 9, 1990 |
| Grant date | Jul 30, 1991 |
| Priority date | — |
| Expiry date | Jul 9, 2010 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/44
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electroless gold plating solution containing 0.1 to 10 ml/l of ethyleneamines and 0.1 to 10 g/l of hexamethylenetetramine as complexing agents in addition to the solution comprising water-soluble gold salts, pH controlling agents, catalysts, alkylamine boranes, alkali cyanides and ethylendiamine tetraacetic acid. According to the present invention, thick coating of a gold plating film having high quality and gloss is possible and the plating time becomes very short.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.