Heat curable, reaction resin mixtures
US5036135A · kind A · utility
16Cited by
5References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 19, 1990 |
| Grant date | Jul 30, 1991 |
| Priority date | — |
| Expiry date | Jul 19, 2010 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G59/4028
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Reaction resin mixtures which can be economically processed provide inflammable molded materials with excellent mechanical properties and high dimensional stability under heat when they contain the following constituents: (A) a phosphorus-free polyfunctional epoxide; (B) an epoxy-group-containing phosphorus compound; (C) a polyfunctional isocyanate; (D) a curing catalyst; and, if required, (E) filler material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.