Alkoxysilane and alkoxysilane terminated polyamic or polyimide lacquer composition
US5036145A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 10, 1989 |
| Grant date | Jul 30, 1991 |
| Priority date | — |
| Expiry date | Jul 10, 2009 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09D183/14
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An alkoxysilane bearing amic acid or derivative thereof is formed by reacting an aromatic or aliphatic dianhydride and an aminoalkyltrialkoxysilane or aminoaryltrialkoxysilane, or reacting an aromatic or aliphatic dianhydride and a diamine to form an amic acid which is reacted with an aminoalkylenetrialkoxysilane. A thin, hard protective silica glass network is formed by reacting the alkoxysilane bearing amic acid with an alkoxysilane, preferably tetraalkoxysilane, and an epoxy bearing silane coupling agnet in an acid catalyzed sol-gel process involving hydrolysis and condensation, which provides an amide/ester modified silica network. In a variation of this process, a polyamic acid bearing anhydride termination is prepared by reacting an excess of a dianhydride with a diamine. The product of this reaction when reacted with an aminoalkylenetrialkoxysilane provides an alkoxysilane bearing oligomeric polyamic acid. The latter product yields an imide modified silica network when subjected to acid catalyzed hydrolysis and condensation with tetraalkoxysilane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.