Method of forming fine patterns
US5037504A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jul 18, 1990 |
| Grant date | Aug 6, 1991 |
| Priority date | — |
| Expiry date | Jul 18, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/135
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A fine pattern is formed by the following steps. A prescribed mask pattern of an electrically insulative material is formed on an electroconductive surface of a base plate of a printing plate, so that the part, other than the mask pattern, of the printing plate becomes an electroconductive printing pattern part. Then, electrolysis is carried out in an electrolyte containing an electrodeposition substance as an ingredient with the printing plate as one electrode and with an opposing electrode, both immersed in the electrolyte, so that the electrodeposition substance is deposited on the electroconductive printing pattern part of the printing plate. Thereafter, the printing plate is withdrawn out from the electrolyte, washed and dried. Then, the deposited substance is transferred onto the surface of a printing object such as a plate of glass or plastic, for forming a pattern thereon. Thereafter, the surface of the printing object is etched with the electrodeposited substance thus transferred as an erosion resistant material. The transfer of the electrodeposition substance without consistency from the printing plate onto the surface of the printing object, followed by etching of the pr…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.