Method of manufacturing a low sheet resistance article
US5037670A · kind A · utility
11Cited by
3References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 1, 1989 |
| Grant date | Aug 6, 1991 |
| Priority date | — |
| Expiry date | Nov 1, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01C7/003
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Fine copper and nickel powders are well mixed in a preselected ratio with bonding agents and carriers as appropriate. The composition then may be patterned upon a substrate by screen printing and subsequent firing in a nitrogen atmosphere to produce a low sheet resistance, low TCR electrical resistor. Various alloy powders, inert materials, and glass frits may be used depending upon the desired characteristics.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.